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Plasma doping dosimetry

机译:等离子体掺杂剂量法

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Plasma immersion ion implantation (PIII) is a large-area doping technique that can provide very high implant current at very low implant energy. Multiple ion species, plasma conditions, and implanter current-voltage waveforms in PIII lead to an exponential implant profile which is different from conventional implant profiles. A methodology is developed for using in situ measurements of the implanter current (I) and implant voltage (V) to derive an energy spectrum for a single implant pulse. The advantage of this technique is that a per-pulse profile may be determined experimentally, even in the presence of substrate etching, without any need for an implant model. If the ion species concentrations in the plasma are known, the energy spectrum found from the ion current and voltage waveforms can be used to construct a per-pulse implant profile. If the ion species distribution is not known a priori for a multispecies plasma, secondary ion mass spectroscopy (SIMS) data from an implanted sample can be used to estimate the ion species distribution and calibrate the IV-generated profile within a factor of two. Data from 1-5 kV, 2.5-5 kHz BF/sub 3/ PIII implants are used to demonstrate the concept. The implant profile for a single pulse can then be used to project the final implant profile and total implanted dose as a function of implant time, Pm pulse frequency, and substrate etching. In this work, an estimated secondary electron yield function is used to separate the total implant current into ion and secondary electron current components. The 25% dose variation error introduced by this effective secondary electron yield function could be avoided in a system which can measure ion current directly.
机译:等离子体浸没离子注入(PIII)是一种大面积掺杂技术,可以以非常低的注入能量提供非常高的注入电流。 PIII中的多种离子种类,等离子体条件和注入机电流-电压波形会导致与常规注入机配置文件不同的指数注入机配置文件。开发了一种方法,该方法用于使用原位测量注入电流(I)和注入电压(V)来得出单个注入脉冲的能谱。该技术的优点在于,即使在存在衬底蚀刻的情况下,也可以通过实验确定每个脉冲的轮廓,而无需注入模型。如果已知等离子体中的离子种类浓度,则可以使用从离子电流和电压波形中找到的能谱来构建每个脉冲的注入轮廓。如果多物种等离子体的先验离子种类分布未知,则可使用来自植入样品的二次离子质谱(SIMS)数据估算离子种类分布,并在两倍的范围内校准IV生成的轮廓。 1-5 kV,2.5-5 kHz BF / sub 3 / PIII植入物的数据用于证明这一概念。然后可以将单个脉冲的植入轮廓用于根据植入时间,Pm脉冲频率和衬底蚀刻来投影最终的植入轮廓和总植入剂量。在这项工作中,使用估计的二次电子产量函数将总注入电流分成离子和二次电子电流分量。在可以直接测量离子电流的系统中,可以避免这种有效的二次电子产率函数引起的25%剂量变化误差。

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