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首页> 外文期刊>Physical review. B, Condensed Matter And Materials Physics >Thermal conductivity of interconnected silicon nanoparticles: Application to porous silicon nanostructures
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Thermal conductivity of interconnected silicon nanoparticles: Application to porous silicon nanostructures

机译:互连硅纳米粒子的热导率:在多孔硅纳米结构中的应用

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摘要

A model describing phonon heat conduction in silicon nanowires formed by interconnected nanoparticles is developed from basic principles of the elementary kinetic theory of gases. The thermal transport in a network of the interconnected nanoparticles forming a nanowire is found to be mainly controlled by the interconnection area. In particular, thermal conductivity of the network is strongly dependent on the ratio of the nanoparticle dimension to the interconnection one. Contrary to the case of classical silicon nanowires having a constant section dimension, the thermal conductivity of the interconnected nanoparticles with a given interconnection dimension decreases along with the nanoparticle dimension increase. The model is applied for thermal transport analysis in porous silicon (PS) nanostructures. In particular, it allows, for the first time, deducing of new structural information on PS nanoscale skeleton such as porosity dependent interconnection dimension and percolation strength of the nanoparticle network.
机译:根据气体基本动力学理论的基本原理,建立了描述由相互连接的纳米粒子形成的硅纳米线中的声子热传导的模型。发现形成纳米线的互连纳米颗粒在网络中的热传输主要受互连区域控制。特别地,网络的热导率在很大程度上取决于纳米颗粒尺寸与互连尺寸的比率。与具有恒定截面尺寸的经典硅纳米线的情况相反,具有给定互连尺寸的互连纳米颗粒的热导率随着纳米颗粒尺寸的增加而降低。该模型适用于多孔硅(PS)纳米结构中的热输运分析。特别是,它首次允许推导PS纳米级骨架上的新结构信息,例如与孔隙率相关的互连尺寸和纳米粒子网络的渗透强度。

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