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The thermal conductivity silicone adhesion agent composition and thermal conductivity silicone elastomer formation item

机译:导热硅酮粘接剂组合物和导热硅酮弹性体形成项目

摘要

PROBLEM TO BE SOLVED: To provide a thermally conductive silicone adhesive composition in which handling and moldability are good even if containing a thermally conductive filler much in order to obtain a high thermal conductivity silicone rubber, and which gives good adhesion with metal, glass, and organic resin; and to provide a silicone elastomer molding obtained by curing the composition.;SOLUTION: The thermally conductive silicone adhesive composition includes a liquefied organohydrogenpolysiloxane which has the viscosity at 25°C of at most 100 mPa s, has 2-10 hydrogen atoms combined with a silicon atom in one molecule, and further has at least one alkoxy group and/or epoxy group which is combined with a silicon atom through an alkylene group, and in which the degree of polymerization of polysiloxane is at most 15, and the skeleton of the polysiloxane contains a cyclic structure.;COPYRIGHT: (C)2012,JPO&INPIT
机译:要解决的问题:提供一种导热硅酮粘合剂组合物,其中即使为了获得高导热率的硅橡胶而含有大量的导热填料也具有良好的操作性和可模塑性,并且该组合物与金属,玻璃和有机树脂;并提供通过固化该组合物而获得的有机硅弹性体模制品。;解决方案:该导热有机硅粘合剂组合物包括液化的有机氢聚硅氧烷,该液化的有机氢聚硅氧烷在25℃下的粘度至多为100 mPa s,具有2-10个氢原子与硅原子在一个分子中,并且还具有至少一个烷氧基和/或环氧基,该烷氧基和/或环氧基通过亚烷基与硅原子结合,并且聚硅氧烷的聚合度至多为15,并且其骨架聚硅氧烷具有环状结构。;版权所有(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP5445415B2

    专利类型

  • 公开/公告日2014-03-19

    原文格式PDF

  • 申请/专利权人 信越化学工業株式会社;

    申请/专利号JP20100211010

  • 发明设计人 岩田 充弘;

    申请日2010-09-21

  • 分类号C09J183/06;C09J183/07;C09J183/04;C09J11/04;C09J11/06;

  • 国家 JP

  • 入库时间 2022-08-21 16:14:37

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