The thermal conductivity silicone constituent, the thermal conductivity silicone compact and its production manner

摘要

PROBLEM TO BE SOLVED: To easily provide a thermal conductive member that is arranged between a heating member (an object requiring heat to be dissipated) and a heat dissipation member of electronic parts etc., has excellent thermal conductivity, can adhere well, and is easy to handle.;SOLUTION: A thermal conductive silicone composition comprising (a) 100 parts of an alkenyl group containing organopolysiloxane, (b) 300-5,000 parts of a thermal conductive filler, (c) an organohydrogenpolysiloxane wherein an amount based on a molar ratio of a SiH group in the component (c) to the alkenyl group in the component (a) is 0.6-10.0, (d) a platinum group metal-based addition reaction catalyst, and (e) a volatile compound having one SiH group, to which an alkenyl group can be added, in a molecule wherein an amount based on a molar ratio of a SiH group in the component (e) to a SiH group in the component (c) is 0.01-2.0, as constituent components, are thermally heated and cured in an open state to form a skin layer on a surface of the open side.;COPYRIGHT: (C)2007,JPO&INPIT