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首页> 外文期刊>Physica status solidi >Potentiometry on pentacene OFETs: Charge carrier mobilities and injection barriers in bottom and top contact configurations
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Potentiometry on pentacene OFETs: Charge carrier mobilities and injection barriers in bottom and top contact configurations

机译:并五苯OFET上的电位计:底部和顶部接触构型的电荷载流子迁移率和注入势垒

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摘要

In a combination of experimental techniques including electrical probes, potentiometry, and charge transient spectro-scopy (QTS), we develop concepts how to quantify the potential drops at the contacts, the mobility in the channel region, and the density of states of deep traps in pentacene OFETs. For OFETs grown from unpurified pentacene on pre-pattemed Au bottom contacts, a comparison between potentiometry and two-dimensional device simulations determines an injection barrier of 0.73 eV at the source contact and a hole mobility of 0.014 cm~2 V~(-1) s~(-1) in the pentacene channel. Temperature-dependent QTS data reveal a trap level at about 125 meV from the hole transport band, indicating a relativelyrnhigh density of unintentional dopants and therefore a high background density of majority charge carriers. In OFETs grown from purified pentacene onto a SiO_2 gate dielectric and Au top contacts evaporated onto the pentacene channel without breaking the vacuum, potentiometry reveals a nearly perfect alignment of the metal work function with the hole transport level in the organic layer. The much lower density of deep traps in these samples raises the hole mobility to the range 0.1-0.2 cm~2 V~(-1) s~(-1). A further improvement of the hole mobility and the resulting device performance can be achieved by a chemical treatment of the gate oxide with n-octadecytrichlorosilane (OTS).
机译:通过结合包括电探针,电位计和电荷瞬变光谱法(QTS)在内的实验技术,我们开发了如何量化触点处的电势降,通道区域的迁移率以及深陷阱的状态密度的概念在并五芳烃中。对于在预构图的金底触点上由未纯化的并五苯生长的OFET,通过电位计和二维器件仿真的比较确定源触点的注入势垒为0.73 eV,空穴迁移率为0.014 cm〜2 V〜(-1)并五苯通道中的s〜(-1)。随温度变化的QTS数据显示出距空穴传输带约125 meV的陷阱能级,这表明非故意掺杂物的密度相对较高,因此多数电荷载流子的背景密度较高。在从纯化的并五苯生长到SiO_2栅极电介质和Au顶部触点蒸发到并五苯通道上而不破坏真空的OFET中,电位计揭示了金属功函数与有机层中空穴传输能级的几乎完美对准。这些样品中深陷阱的密度低得多,从而将空穴迁移率提高到0.1-0.2 cm〜2 V〜(-1)s〜(-1)的范围。通过用正十八烷基三氯硅烷(OTS)对栅氧化物进行化学处理,可以实现空穴迁移率和所得器件性能的进一步改善。

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