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Mask-free prototyping of metal-oxide- semiconductor devices utilizing focused electron beam induced deposition

机译:利用聚焦电子束诱导沉积的金属氧化物半导体器件的无掩模原型设计

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Focused electron beam induced deposition (FEBID) is a novel direct-writing technique to produce noble metal nanostructures. In this work, FEBID has been employed for the first time to fabricate metal-oxide-semiconductor capacitors (MOSCAPs). Experimental parameters such as precursor temperature, substrate temperature and the (de)focus of the electron beam have been optimized to deposit electrode structures of a relatively large area within a short timeframe. Using FEBID, gold electrodes have been deposited on top of an atomic layer deposited (ALD) dielectric aluminum oxide layer. Chemical composition of the produced structures has been studied using energy dispersive X-ray spectroscopy (EDX). Current-voltage (Ⅰ-Ⅴ) measurements have confirmed the conductivity of FEBID gold nanowires (NWs). Measured capacitance-voltage (C-V) characteristics of FEBID-fabricated MOSCAP prototypes resemble the typical C-V characteristics of conventionally fabricated MOSCAPs, thus confirming the functionality of our FEBID devices. Illustration of a MOS capacitor fabricated by FEBID.
机译:聚焦电子束诱导沉积(FEBID)是一种新颖的直接写入技术,可产生贵金属纳米结构。在这项工作中,FEBID首次用于制造金属氧化物半导体电容器(MOSCAP)。已经优化了诸如前驱物温度,衬底温度和电子束的(散焦)之类的实验参数,以在短时间内沉积较大面积的电极结构。使用FEBID,金电极已沉积在原子层沉积(ALD)电介质氧化铝层的顶部。已使用能量色散X射线光谱(EDX)研究了所生产结构的化学成分。电流电压(Ⅰ-Ⅴ)的测量已经证实了FEBID金纳米线(NWs)的导电性。 FEBID制造的MOSCAP原型的测得的电容-电压(C-V)特性类似于常规制造的MOSCAP的典型C-V特性,从而证实了我们的FEBID器件的功能。 FEBID制造的MOS电容器的插图。

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