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首页> 外文期刊>Physica status solidi >Flip-chip bonding and fabrication of well-ordered nanocolumn arrays on sputter-deposited AlN/Si (111) substrate
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Flip-chip bonding and fabrication of well-ordered nanocolumn arrays on sputter-deposited AlN/Si (111) substrate

机译:倒装键合和溅射沉积的AlN / Si(111)衬底上的有序纳米柱阵列的制造

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摘要

Employing a thin AlN film sputter-deposited on Si substrates, well-ordered GaN nanocolumn arrays were demonstrated by RF-plasma-assisted molecular-beam-epitaxy selective-area growth. Dislocation-free crystals were grown even on this cost-effective framework, which included high-density threading dislocations (>3 × 10~(11) cm~(-2)), by applying nanocolumn growth techniques. Single-peak PL spectra from integrated InGaN/GaN MQW were obtained in red region and the peak wavelength changed from 640, to 690 nm with increasing nanocolumn diameter. This framework also contributes to a fabrication of vertical injection type flip-chip structure, even if a nanocolumn device. Damage-free wet-etching removal of Si substrates resulted in exposure of flip-chip well-ordered nanocolumns array. (a) TEM image of nanocolumns array on sputter-deposited thin AlN film/Si (111) substrate, (b) SEM image of flip-chip well-ordered nanocolumns array.
机译:利用溅射沉积在Si衬底上的AlN薄膜,通过RF-等离子体辅助的分子束外延选择性区域生长证明了井井有条的GaN纳米柱阵列。通过采用纳米柱生长技术,即使在这种具有成本效益的框架上也可以生长无位错的晶体,该框架包括高密度的螺纹位错(> 3×10〜(11)cm〜(-2))。从集成的InGaN / GaN MQW中获得了红色区域的单峰PL光谱,并且随着纳米柱直径的增加,峰值波长从640 nm变为690 nm。即使是纳米柱器件,该框架也有助于垂直注入型倒装芯片结构的制造。硅衬底的无损伤湿法刻蚀去除导致倒装芯片的有序纳米柱阵列暴露。 (a)溅射沉积的薄AlN膜/ Si(111)衬底上的纳米柱阵列的TEM图像,(b)倒装芯片的有序纳米柱阵列的SEM图像。

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