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On the use of the thermal step method as a tool for study of space charge in semiconductor gallium nitride: GaN

机译:关于使用热步进法作为研究半导体氮化镓中的空间电荷的工具GaN

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摘要

Thermal step method (TSM) is a non destructive technique which measures the distribution of electric field and the space charge density across a solid insulators. In this paper, we report the experimental results obtained by the Thermal step method (TSM) and The capacitive voltage (C-V) characterisations of the gallium nitride films grown by the Metal Organic Vapour Phase Epitaxy on silicon substrate. The C-V curves shows a MOS structure behaviours, this was attributed to the existence of an SiO_2 insulator between silicon and GaN. Experimental results were in good accordance with TSM measurements. These where performed under different applied bias voltage, remnant saturation current indicate a sign inversion above -75 mV.
机译:热步法(TSM)是一种非破坏性技术,可测量固体绝缘子上的电场分布和空间电荷密度。在本文中,我们报告了通过热步进法(TSM)和通过金属有机气相外延在硅衬底上生长的氮化镓膜的电容电压(C-V)表征获得的实验结果。 C-V曲线显示了MOS结构的行为,这归因于在硅和GaN之间存在SiO_2绝缘体。实验结果与TSM测量结果非常吻合。在不同的施加偏置电压,残余饱和电流的情况下执行这些指示在-75 mV以上的符号反转。

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