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Thermal stability of devices with molybdenum oxide doped organic semiconductors

机译:氧化钼掺杂的有机半导体器件的热稳定性

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摘要

We demonstrate the thermal stability of transition-metal-oxide (molybdenum oxide; MoO_3)-doped organic semiconductors. Impedance spectroscopy analysis indicated that thermal deformation of the intrinsic 1,4-bis[N-(1-naphthyl)-N'-phenylamino]-4,4'-diamine (NPB) layer is facilitated when the MoO_3-doped NPB layer is deposited on the intrinsic NPB layer. The resistance of the intrinsic NPB layer is reduced from 300 kΩ to 3 kΩ after thermal annealing at 100 ℃ for 30 min. Temperature-dependent conductance/angular frequency-frequency (G/w-f-T) analysis revealed that the doping efficiency of MoO_3, which is represented by the activation energy (E_a). is reduced after the annealing process.
机译:我们证明了过渡金属氧化物(氧化钼; MoO_3)掺杂的有机半导体的热稳定性。阻抗谱分析表明,当掺杂MoO_3的NPB层为1,4,4-双[N-(1-萘基)-N'-苯氨基] -4,4'-二胺(NPB)层时,热变形容易发生。沉积在本征NPB层上。在100℃下热退火30分钟后,本征NPB层的电阻从300kΩ降低到3kΩ。温度相关的电导/角频率-频率(G / w-f-T)分析表明,MoO_3的掺杂效率由活化能(E_a)表示。在退火过程之后减少。

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