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Self-doping And Partial Oxidation Of Metal-on-organic Interfaces For Organic Semiconductor Devices Studied By Chemical Analysis Techniques

机译:化学分析技术研究有机半导体器件上有机金属界面的自掺杂和部分氧化

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The performance of organic electronic devices, such as organic light emitting diodes, transistors, or organic solar cells, depends critically on the chemical composition of the metal/organic and organic/ metal interfaces which inject or extract charges into or from the device. By combining a number of techniques, such as x-ray photoemission spectroscopy (XPS) sputter depth profiling, XPS itself, secondary ion mass spectrometry, and laser desorption/ionization time-of-flight mass spectrometry, we investigate the reasons for differences in charge injection from metallic bottom and top contacts into either preferentially hole or preferentially electron transporting materials. We find that the deposition of metal onto organic semiconductors creates an organic-inorganic mixed interlayer in between the organic bulk material and the metal. In the case of electron injection, this interlayer acts as highly doped injection layer, while for hole injection, no significant improvement is visible. In addition to the self-doping, some cathode materials form partially oxidized metal-on-organic interfaces caused by oxygen in the residual gas. Depending on the evaporation conditions, the oxygen content varies. The effect of the oxygen incorporation, the origin, and the binding behavior in between the metal-on-organic interlayer is investigated and discussed. In contrast, organic materials evaporated on top of metals create an abrupt interface, where no self-doping effect is observed.
机译:有机电子设备(例如有机发光二极管,晶体管或有机太阳能电池)的性能关键取决于向设备中注入或提取电荷的金属/有机和有机/金属界面的化学成分。通过结合多种技术,例如X射线光电子能谱(XPS)溅射深度分析,XPS本身,二次离子质谱和激光解吸/电离飞行时间质谱,我们研究了电荷差异的原因从金属的底部和顶部触点注入到空穴或电子传输材料中。我们发现金属在有机半导体上的沉积会在有机块状材料和金属之间形成有机-无机混合中间层。在电子注入的情况下,该中间层充当高掺杂注入层,而对于空穴注入,没有明显改善。除自掺杂外,某些阴极材料还形成了由残留气体中的氧气引起的部分氧化的金属有机界面。取决于蒸发条件,氧含量变化。研究并讨论了氧在有机金属夹层之间的掺入,来源和结合行为的影响。相反,有机材料在金属上蒸发会形成一个突然的界面,没有观察到自掺杂效应。

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