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Ruggedization of CdZnTe detectors and detector assemblies for radiation detection applications

机译:坚固耐用的CdZnTe探测器和探测器组件,用于辐射探测应用

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This paper described improvements in the ruggedization of CdZnTe detectors and detector assemblies for use in radiation detection applications. Research included experimenting with various conductive and underfill adhesive material systems suitable for CZT substrates. A detector design with encapsulation patterning was developed to protect detector surfaces and to control spacing between CZT anode and PCB carrier. Robustness of bare detectors was evaluated through temperature cycling and metallization shear testing. Attachment processes using well-chosen adhesives and PCB carrier materials were optimized to improve reliability of detector assemblies, resulted in Improved Attachment Detector Assembly. These detector assemblies were subjected to aggressive temperature cycling, and varying levels of drop/shock and vibration, in accordance with modified JEDEC, ANSI and FedEx testing standards, to assess their ruggedness. Further enhanced detector assembly ruggedization methods were investigated involving adhesive conformal coating, potting and dam filling on detector assemblies, which resulted in the Enhanced Ruggedization Detector Assembly. Large numbers of CZT detectors and detector assemblies with 5 mm and 15 mm thick, over 200 in total, were tested. Their performance was evaluated by exposure to various radioactive sources using comprehensive predefined detector specifications and testing protocols. Detector assemblies from improved attachment and enhanced ruggedization showed stable performances during the harsh environmental condition tests. In conclusion, significant progress has been made in improving the reliability and enhancing the ruggedness of CZT detector assemblies for radiation detection applications deployed in operational environments.
机译:本文介绍了用于辐射检测应用的CdZnTe检测器和检测器组件的坚固性方面的改进。研究包括试验各种适用于CZT基材的导电和底部填充胶材料系统。开发了具有封装图案的检测器设计,以保护检测器表面并控制CZT阳极与PCB载体之间的间距。裸露探测器的坚固性通过温度循环和金属化剪切测试进行了评估。优化了使用精选粘合剂和PCB载体材料的附着过程,以提高探测器组件的可靠性,从而改进了附着探测器组件。根据改良的JEDEC,ANSI和FedEx测试标准,这些检测器组件经历了剧烈的温度循环以及各种水平的跌落/震动和振动,以评估其坚固性。进一步研究了增强型探测器组件的加固方法,包括在探测器组件上进行胶体保形涂层,灌封和填坝,从而形成了增强型加固型探测器组件。测试了大量的CZT探测器和探测器组件,其厚度分别为5毫米和15毫米,总共超过200个。使用全面的预定义探测器规格和测试协议,通过暴露于各种放射源来评估其性能。通过改进的附件和增强的坚固性,探测器组件在恶劣的环境条件测试中表现出稳定的性能。总之,在为部署在操作环境中的辐射检测应用程序提高CZT检测器组件的可靠性和增强其耐用性方面,已经取得了重大进展。

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