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首页> 外文期刊>Multi-Scale Computing Systems, IEEE Transactions on >Impact of Write Pulse and Process Variation on 22 nm FinFET-Based STT-RAM Design: A Device-Architecture Co-Optimization Approach
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Impact of Write Pulse and Process Variation on 22 nm FinFET-Based STT-RAM Design: A Device-Architecture Co-Optimization Approach

机译:写脉冲和工艺变化对基于22nm FinFET的STT-RAM设计的影响:器件-架构协同优化方法

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摘要

Spin-transfer torque random access memory (STT-RAM) is a promising candidate for universal memory due to its speed, scalability, and non-volatility. A wide range of write speeds from to have been reported for STT-RAM. As the storage element of an STT-RAM cell, the switching current of magnetic tunnel junction (MTJ) is inversely proportional to the write pulse width. In this work, we propose a methodology to design STT-RAM for different optimization goals such as read performance, write performance, and write energy by leveraging the trade-off between write current and write time of MTJ. To enable STT-RAM design in advanced technology nodes beyond 22 nm, we model perpendicular MTJ (PMTJ) as the storage element and FinFET as the access transistor. Our study shows that reducing write pulse width will harm read latency and energy. It is observed that “sweet spots” of write pulse width which minimize the write energy or write latency of an STT-RAM macro may exist. The optimal write pulse width depends on both the device and the architecture specifications. The impact of process variations including the MTJ and the FinFET access transistor are also analyzed.
机译:自旋转移矩随机存取存储器(STT-RAM)由于其速度,可伸缩性和非易失性而成为通用存储的有希望的候选者。对于STT-RAM,已经报道了从到的多种写入速度。作为STT-RAM单元的存储元件,磁性隧道结(MTJ)的开关电流与写入脉冲宽度成反比。在这项工作中,我们提出了一种方法,可以通过利用MTJ的写入电流和写入时间之间的折衷来设计用于不同优化目标(例如读取性能,写入性能和写入能量)的STT-RAM。为了在22nm以上的先进技术节点中实现STT-RAM设计,我们将垂直MTJ(PMTJ)建模为存储元件,将FinFET建模为访问晶体管。我们的研究表明,减小写入脉冲宽度会损害读取延迟和能量。可以观察到,可能存在使STT-RAM宏的写能量或写等待时间最小的写脉冲宽度的“最佳点”。最佳写入脉冲宽度取决于器件和架构规格。还分析了包括MTJ和FinFET存取晶体管在内的工艺变化的影响。

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