New SMT 38 GHz Chipset Meets Market Needs

摘要

Sustained growth in wireless communications and greater demands for bandwidth place tremendous pressure on component manufacturers to provide high performance, surface-mount technology (SMT) packaged products. The market is seeking low-cost, SMT components for high volume printed circuit board (PCB) assembly flow, particularly for applications such as point-to-point (PTP) digital radio at microwave and millime-rnter-wave frequencies. The drivers for industry growth in the PTP market are next generation data services and the rapid expansion of cellular usage in developing nations such as China and India. In order to meet the performance, cost and time to market requirements of these systems, OEMs are turning to complete SMT chipset solutions.