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首页> 外文期刊>Microwave Engineering Europe >Multi-function 38 GHz packaged chipsets meet the performance demands and the cost-challenge for current and future radio requirements
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Multi-function 38 GHz packaged chipsets meet the performance demands and the cost-challenge for current and future radio requirements

机译:多功能38 GHz封装芯片组可满足当前和未来无线电需求的性能要求和成本挑战

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摘要

Last year witnessed remarkable growth in digital radio unit shipments for point-to-point (PTP) microwave links. Growth is expected to continue over the next few years with demand being driven predominantly by mobile base station infrastructure. Also, with the introduction of new wireless mobile services and the continual development of interactive media services such as video on handheld devices, the market is predicted to remain robust and healthy.
机译:去年见证了点对点(PTP)微波链路的数字无线电单元出货量的显着增长。预计未来几年将继续增长,其中需求主要由移动基站基础设施推动。此外,随着新的无线移动服务的推出以及交互式媒体服务(如手持设备上的视频)的不断发展,预计市场将保持强劲和健康。

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