Ericsson and STMicroelectronics to create joint-venture in semiconductors and platforms for mobile applications

摘要

STMicroelectronics and Ericsson have announced an agreement to merge Ericsson Mobile Platforms and ST-NXP Wireless into a joint venture. The 50/50 joint venture aims to deliver the industry's strongest product offering in semiconductors and platforms for mobile applications and will be an important supplier to Nokia, Samsung, Sony Ericsson, LG and Sharp. It will employ almost 8,000 people with pro-forma 2007 sales of USD 3.6B. ST is expected to exercise its option to buy NXP's 20 percent of ST-NXP Wireless before closing this transaction.rnIn the joint venture, ST contributes its multimedia and connectivity solutions as well as a complete 2G/EDGE platform and 3G offering, including customer relationships with Nokia, Samsung, and Sony Ericsson. Ericsson contributes its 3G and LTE platform technology as well as customer relationships with Sony Ericsson, LG and Sharp. The joint venture is designed for Jong-term stability in its original structure, and aims to become an industry leader in product research, as well as design, development, andrnthe creation of cutting-edge mobile platforms and wireless semiconductors.