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A 60-GHz multilayer parasitic microstrip array antenna on LTCC substrate for system-on-package

机译:用于系统级封装的LTCC基板上的60 GHz多层寄生微带阵列天线

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摘要

This letter describes a compact and high-gain multilayer parasitic microstrip array antenna (MPMAA). The design and performance of the proposed array antenna are presented. The antenna employs three layers with a 2/spl times/2 parasitic array on each layer. The developed prototype MPMAA employs a multilayer low-temperature co-fired ceramic (LTCC) substrate that is well suited to the assembly of MMIC chips. The fabricated MPMAA achieves a 7.17 dBi absolute gain at 60 GHz including the loss derived from the feeding parts and RF probe to measure its antenna performance. The spacing of the top layer of the parasitic array constructed by 2/spl times/2 elements has a free-space wavelength of 0.36 and the chip size is 10 mm/sup 2/. The fabricated MPMAA achieves both compact and high directional gain and satisfies the requirements for a millimeter-wave system-on-package (SOP).
机译:这封信描述了一种紧凑且高增益的多层寄生微带阵列天线(MPMAA)。介绍了所提出的阵列天线的设计和性能。天线采用三层,每层上具有2 / spl times / 2寄生阵列。开发的原型MPMAA采用了多层低温共烧陶瓷(LTCC)基板,非常适合MMIC芯片的组装。所制造的MPMAA在60 GHz时可实现7.17 dBi的绝对增益,其中包括从馈电部件和RF探针测量其天线性能所引起的损耗。由2 / spl乘以/ 2个元件构成的寄生阵列的顶层的间隔具有0.36的自由空间波长,并且芯片尺寸为10mm / sup 2 /。所制造的MPMAA既可以实现紧凑的定向增益又可以实现高定向增益,并且满足毫米波封装系统(SOP)的要求。

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