This paper presents a flip-chip based packaging technique for encapsulating MEMS electrostatic actuators for biomedical applications. High-performance electrostatic inchworm actuators are used to demonstrate the packaging technique. A wall structure is put around the actuator surrounding it completely but leaving a small clearance where the actuator shuttle can extend off the edge of the chip. A cap chip is fabricated separately, and flip-chipped onto the actuator. Au–Au thermal bonding technique is used to fix the cap. Finally, rendering the surfaces of the clearance hydrophobic prevents the water ingress when the actuator operates in water.
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