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Compact modeling of dynamic trap density evolution for predicting circuit-performance aging

机译:动态陷阱密度演化的紧凑模型,用于预测电路性能老化

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It is shown that a compact MOSFET-aging model for circuit simulation is possible by considering the dynamic trap-density increase, which is induced during circuit operation. The dynamic trap/detrap phenomenon, which influences the switching performance, is also considered on the basis of well-known previous results. Stress dependent hot-carrier effect and NBTI effect, origins of the device aging, are modeled during the circuit simulation for each.device by integrating the substrate current as well as by determining the oxide-field change due to the trapped carriers over the individual stress-duration periods. A self-consistent solution can be obtained only by, iteratively solving the Poisson equation including the dynamically changing trap density, which is achieved with negligible simulation time penalty. To enable accurate circuit-aging simulation, even for high-voltage MOSFETs, the carrier traps within the highly resistive drift region are additionally considered.
机译:结果表明,通过考虑电路工作期间引起的动态陷阱密度的增加,可以实现用于电路仿真的紧凑型MOSFET老化模型。基于先前已知的结果,也考虑了会影响开关性能的动态陷波/去陷现象。应力依赖的热载流子效应和NBTI效应是器件老化的根源,在每个器件的电路仿真过程中都通过对衬底电流进行积分以及确定由于单个应力上被俘获的载流子引起的氧化场变化来对每个器件进行建模持续时间。只有通过迭代求解包含动态变化的陷阱密度的泊松方程,才能获得自洽解,而仿真时间损失可以忽略不计。为了实现精确的电路老化仿真,即使对于高压MOSFET,也要考虑高阻漂移区内的载流子陷阱。

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