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A fast simulation method for analysis of SEE in VLSI

机译:一种快速仿真方法,用于分析VLSI

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摘要

The transistor simulation tools (e.g. TCAD and SPICE) are widely used to simulate single event effects (SEE) in industry. However, due to the variances of the physical parameters in practical design, e.g. the nature of the particle, linear energy transfer and circuit characteristics would have a large impacts on the final simulation accuracy, which will significantly increase the complexity and cost in the workflow of the transistor level simulation for large scale circuits. Therefore, a new SEE simulation scheme is proposed to offer a fast and costefficient method to evaluate and compare the performance of large scale circuits in the effects of radiation particles. In this work, we have combined both the advantages of transistor and hardware description language (HDL) simulations, and proposed accurate SEE digital error models for high-speed error analysis in the large scale circuits. The experimental results show that the proposed scheme is able to handle SEE simulations for more than 40 different circuits with the sizes varied from 100 transistors to 100 k transistors.
机译:晶体管仿真工具(例如TCAD和Spice)广泛用于模拟工业中的单一事件效果(参见)。但是,由于实际设计中物理参数的差异,例如,粒子,线性能量传递和电路特性的性质将对最终模拟精度产生大的影响,这将显着提高大型电路晶体管电平模拟工作流程的复杂性和成本。因此,提出了一种新的参考模拟方案来提供快速和成本的方法来评估和比较大尺度电路在辐射粒子的影响中的性能。在这项工作中,我们组合了晶体管和硬件描述语言(HDL)仿真的优点,并提出了大规模电路中的高速误差分析的准确看数字误差模型。实验结果表明,所提出的方案能够处理超过40个不同电路的仿真,尺寸从100个晶体管变化到100k晶体管。

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