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InP DHBT technology for power amplifiers at mm-wave frequencies

机译:用于毫米波频率功率放大器的InP DHBT技术

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An InP Double Heterojunction Bipolar Transistor (DHBT) technology is presented for millimeter-wave power amplifiers at E-band and higher frequencies. Single-and multi-finger transistors with 0.7 mu m emitter width and emitter lengths of 5, 7, 10 mu m are designed for high frequency and high power applications. The static and AC performances of the fabricated devices are discussed. Reported cutoff frequency and maximum oscillation frequency are f(t) = 267 GHz and f(max) = 450 GHz for a 0.7 x 5 mu m(P2) single-finger device, respectively. Results from large-signal measurements at 30 GHz are reported for single and 4-finger devices. Ballasted devices are introduced to improve thermal behaviour and to increase the limits of the safe operating area (SOA). The SOA is improved approximately by 75% for 4-finger devices with 0.7 x 10 mu m(2) emitter. A fabricated monolithic microwave integrated circuit (MMIC) at E-band based on stacked InP DHBTs is presented and its performances reported to demonstrate the power capabilities of the technology.
机译:针对E波段及更高频率的毫米波功率放大器,提出了InP双异质结双极晶体管(DHBT)技术。具有0.7微米发射极宽度和5、7、10微米发射极长度的单指和多指晶体管设计用于高频和高功率应用。讨论了所制造设备的静态和交流性能。对于0.7 x 5μm(P2)单指器件,报告的截止频率和最大振荡频率分别为f(t)= 267 GHz和f(max)= 450 GHz。报告了单指和四指设备在30 GHz下的大信号测量结果。引入镇流器可改善热性能并增加安全工作区(SOA)的限制。对于具有0.7 x 10μm(2)发射器的四指设备,SOA大约提高了75%。提出了一种基于堆叠式InP DHBT的E波段制造的单片微波集成电路(MMIC),并报告了其性能以证明该技术的功率性能。

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