Thermo-mechanical behavior and micro structural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films

摘要

The stress evolution in electrochemically deposited copper-silver alloy thin films during thermal cycling from RT up to 500℃ is presented. Stress-temperature behavior was studied by laser-optical substrate curvature measurements, and the results are compared with the behavior of pure copper films. It will be shown that Cu(Ag) reacts elastically to thermal stress loading up to 180℃. The influence of the substrate on the σ(T) curves will be discussed. Furthermore, micro-structure (e.g., grain size, single grain orientation) developing during thermal treatment has been investigated. It is shown that the microstructure of Cu(Ag) films is thermally stable after the first cycle.