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Preparation of α-alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate

机译:α-氧化铝/聚甲基丙烯酸复合磨料的制备及其在玻璃基板上的CMP性能

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摘要

Chemical mechanic polishing (CMP) has become a widely accepted global planarization technology. Abrasive is one of key elements during CMP process. α-Alumina particles, as a kind of widely used abrasive in CMP slurries, often cause surface defects due to its high hardness and agglomeration. In order to enhance the dispersion stability and prevent agglomeration of pure alumina abrasives in CMP, α-alumina grafted with polymethacrylic acid (α-Al_2O_3-g-PMAA) composite abrasives was prepared and characterized by means of Fourier transform infrared (FTIR), Mastersizer 2000 instrument and scanning electron microscope (SEM). The results indicated that the prepared α-Al_2O_3-g-PMAA composite abrasives have better dispersion stability than pure α-Al_2O_3 abrasives. The CMP performances of the α-Al_2O_3-g-PMAA composite abrasives on glass substrate were investigated by SPEEDFAM-16B-4M CMP equipment with different process parameters. By using the optimum process parameters, the prepared abrasives exhibit better glass substrate CMP performance than pure α-Al_2O_3 abrasives. Further, the CMP mechanism of glass substrate was deduced preliminarily.
机译:化学机械抛光(CMP)已成为一种广泛接受的全球平面化技术。研磨是CMP过程中的关键要素之一。作为CMP浆料中广泛使用的一种磨料,α-氧化铝颗粒由于其高硬度和团聚性而经常引起表面缺陷。为提高分散稳定性并防止纯氧化铝磨料在CMP中结块,制备了接枝有聚甲基丙烯酸(α-Al_2O_3-g-PMAA)的α-氧化铝复合磨料,并通过傅里叶变换红外光谱(FTIR),Mastersizer进行了表征。 2000仪器和扫描电子显微镜(SEM)。结果表明,所制备的α-Al_2O_3-g-PMAA复合磨料的分散稳定性优于纯α-Al_2O_3磨料。利用SPEEDFAM-16B-4M CMP设备,采用不同工艺参数研究了α-Al_2O_3-g-PMAA复合磨料在玻璃基板上的CMP性能。通过使用最佳工艺参数,所制备的磨料比纯α-Al_2O_3磨料具有更好的玻璃基板CMP性能。此外,初步推导了玻璃基板的CMP机理。

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