机译:含低熔点焊料的自组装各向异性导电胶体系的化学流变特性
Next Generation Packaging Team, Electronics and Telecommunications Research Institute, 161 Gajeong-dong, Yuseong-gu, Daejeon 305-700, Republic of Korea Department of Polymer Science and Engineering, Sungkyunkwan University, Suwon, Republic of Korea;
rnNext Generation Packaging Team, Electronics and Telecommunications Research Institute, 161 Gajeong-dong, Yuseong-gu, Daejeon 305-700, Republic of Korea Department of Polymer Science and Engineering, Sungkyunkwan University, Suwon, Republic of Korea;
rnNext Generation Packaging Team, Electronics and Telecommunications Research Institute, 161 Gajeong-dong, Yuseong-gu, Daejeon 305-700, Republic of Korea;
Next Generation Packaging Team, Electronics and Telecommunications Research Institute, 161 Gajeong-dong, Yuseong-gu, Daejeon 305-700, Republic of Korea;
Department of Mechanical Engineering, ChungAng University, Seoul, Republic of Korea;
rnDepartment of Polymer Science and Engineering, Sungkyunkwan University. Suwon, Republic of Korea;
anisotropic conductive adhesive; low-melting point solder; chemo-rheology; reductant;
机译:多壁碳纳米管(MWCNT)浓度对可焊各向异性导电胶(SACA)的热机械可靠性性能的影响
机译:多壁碳纳米管(MWNT)浓度对可焊各向异性导电胶(SACA)互连性能的影响
机译:使用可焊ACA(各向异性导电胶)的自组织互连过程
机译:各向异性导电胶膜(ACF)组件中导电粒子的电特性分析
机译:磁对准Z轴各向异性导电胶及其应用。
机译:分析用于自动生产智能纺织品的热压焊绝缘置换连接(IDC)和各向异性导电胶(ACA)
机译:碳纳米管填充焊接各向异性导电粘合剂的可靠性特性