机译:通过施加超声前能量促进引线键合中的金属间形成
Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL 35487, United States;
Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL 35487, United States;
Wotfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough LEll 3TU, United Kingdom;
Wotfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough LEll 3TU, United Kingdom;
School of Materials Science and Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore;
wire bonding; intermetallic compounds; interface; ultrasonic energy; bonding mechanism;
机译:热超声丝键合中金属间化合物的形成和生长:空位-溶质结合能的意义
机译:Al垫和Ag-xPd合金线之间的焊线金属间化合物形成
机译:焊丝尺寸对金属间化合物和柯肯达尔空隙的形成对热超声焊丝热老化的影响
机译:在150℃下的高温退火期间Au / Al热循环引线键合中的金属间化合物形成为导线材料
机译:First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =电子封装中的第一级互连:合金银互联金属生长动力学 和他们的机械可靠性 对线束的影响
机译:应用线传感器测量建筑结构的动态变形
机译:微电子封装中金和铜线键合的腐蚀研究和金属间化合物的形成