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机译:新型碱性浆料与市售除渣浆料的CMP性能比较研究
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;
Market Information, Department of CSPC, Zhongqi Pharmaceutical Technology (Shijianzhuang) Co., Ltd., Shijiazhuang 050051, China;
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;
barrier CMP; novel alkaline slurry; by comparison; surface roughness; dishing; erosion;
机译:浆料对碱性浆料中铜CMP性能的影响
机译:专为铜和阻挡层CMP开发的不含BTA的碱性浆料
机译:具有新型弱碱性螯合剂的下一代阻隔CMP浆料
机译:平坦性的开发改善了无磨料的耐磨铜CMP浆料基于电化学研究的无选择性屏障CMP浆料
机译:CMP过程中的磨料颗粒轨迹和材料去除不均匀性以及CMP浆料的过滤特性-模拟和实验研究。
机译:使用光密度法和折射率测量表征CMP浆料
机译:新型浆料注入系统改善了浆料流动和减少Cmp的缺陷