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Titanium nitride as electrode for MOS technology and Schottky diode: Alternative extraction method of titanium nitride work function

机译:氮化钛作为MOS技术和肖特基二极管的电极:氮化钛功函数的另一种提取方法

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摘要

Titanium nitride (TiN) films have been used as gate electrodes in metal-oxide-semiconductor (MOS) capacitors, which were fabricated with SiO_2 layer as gate dielectric, and as upper electrodes in Schottky diodes on Si substrates. The TiN layer has presented the electrical resistivity of 270 μΩ cm and poly crystalline structure (Ti_2N and TiN phase formation), which were extracted by four probe testing, and, X-ray diffraction and Raman spectroscopy, respectively. To get both MOS and Schottky devices on the same substrate, with TiN/SiO_2/Si/Al and TiN/Si/Al structures, respectively, 300 nm thick TiN layer was simultaneously deposited by DC sputtering process on SiO_2/Si and on Si on the same n-type substrate. The MOS capacitors and Schottky diodes were sintered in conventional furnace in forming gas at 450 ℃ for different annealing times between 5 and 30 min. These devices were electrical characterized by capacitance-voltage (C-V) and current-voltage (I-V) measurements, respectively. With both measurements from capacitors and diodes fabricated on the same substrate, the TiN work function values were extracted, resulting in values between 4.5 and 4.2 eV. These values agree with results from literature. Our TiN work function extraction method presents higher accuracy, due to two different measurements were carried out to extract the same parameter, and lower defect incorporation on semiconductor surface can occur, because both devices were fabricated on the same substrate at the same conditions. Furthermore, the distortion in MOS capacitor C-V curve is reduced at 10 min of sintering process, indicating that the charge density at TiN/SiO_2/Si/Al structures is reduced to one level of 1010 cm~(-2). From the I-V curves of Schottky diodes, the ideality factor between 1.0 and 1.5 was extracted. And, these excellent results, such as low charge density of 1010 cm~(-2), the ideality factor of 1.0, and work function of 4.2 eV, indicates that TiN electrodes can be used for MOS technology and Schottky diode.
机译:氮化钛(TiN)膜已被用作金属氧化物半导体(MOS)电容器中的栅电极,该电容器以SiO_2层作为栅电介质制造,并用作了Si衬底上的肖特基二极管的上电极。 TiN层具有270μΩcm的电阻率和多晶结构(Ti_2N和TiN相形成),分别通过四个探针测试以及X射线衍射和拉曼光谱法提取。为了使MOS和肖特基器件都在同一衬底上,分别具有TiN / SiO_2 / Si / Al和TiN / Si / Al结构,通过DC溅射工艺同时在SiO_2 / Si和Si上沉积300 nm厚的TiN层。相同的n型基板。 MOS电容器和肖特基二极管在常规炉中烧结形成气体,温度为450℃,退火时间为5至30分钟。这些设备的电气特性分别通过电容电压(C-V)和电流电压(I-V)测量来表征。通过在同一基板上制造的电容器和二极管的测量,提取了TiN功函数值,得出的值在4.5至4.2 eV之间。这些值与文献结果一致。我们的TiN功函数提取方法具有较高的精度,这是因为执行了两次不同的测量以提取相同的参数,并且由于在相同的条件下将两个器件都制造在同一衬底上,因​​此在半导体表面的掺入率较低。此外,在烧结过程的10分钟时,MOS电容器C-V曲线的畸变减小,表明TiN / SiO_2 / Si / Al结构的电荷密度降低到1010 cm〜(-2)的一个水平。从肖特基二极管的I-V曲线中,提取出1.0到1.5之间的理想因子。而且,这些优异的结果,例如1010 cm〜(-2)的低电荷密度,1.0的理想因子和4.2 eV的功函,表明TiN电极可用于MOS技术和肖特基二极管。

著录项

  • 来源
    《Microelectronic Engineering》 |2012年第4期|p.86-90|共5页
  • 作者单位

    School of Electrical and Computer Engineering, University of Campinas, P.O. Box 6101, 13083-970 Campinas-SP, Brazil,Center for Semiconductor Components, University of Campinas, P.O. Box 6061, 13083-870 Campinas-SP, Brazil;

    School of Electrical and Computer Engineering, University of Campinas, P.O. Box 6101, 13083-970 Campinas-SP, Brazil,Center for Semiconductor Components, University of Campinas, P.O. Box 6061, 13083-870 Campinas-SP, Brazil;

    School of Electrical and Computer Engineering, University of Campinas, P.O. Box 6101, 13083-970 Campinas-SP, Brazil,Center for Semiconductor Components, University of Campinas, P.O. Box 6061, 13083-870 Campinas-SP, Brazil;

    Center for Semiconductor Components, University of Campinas, P.O. Box 6061, 13083-870 Campinas-SP, Brazil;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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