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The physical and electrical characterizations of Cr-doped BiFeO3 ferroelectric thin films for nonvolatile memory applications

机译:用于非易失性存储应用的Cr掺杂BiFeO3铁电薄膜的物理和电气特性

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摘要

Metal-ferroelectric (Cr-substituted BiFeO3)-insulator (HfO2)-semiconductor (MFIS) structures have been fabricated by co-sputtering technique. The crystalline phases of Cr3+ substitution at Fe-site for BiFeO3 (BFO) films were investigated by XRD patterns at the postannealing temperatures of 500 degrees C, 600 degrees C, and 700 degrees C. The microstructure of Cr-substituted BiFeO3 thin film and interfacial layer between HfO2 and Si substrate were characterized by TEM. The memory window as functions of insulator film thickness and DC power for Cr was investigated. The maximum memory window is 1.7 V when the HfO2 thickness increases to 60 nm. The ferroelectric polarization increases with increasing substitution amount due to the reduction in charge injection effect. The result is consistent with the leakage current measured. As the substitution amount increases or postannealing temperature decreases, the surface roughness becomes smooth due to less crystallization of Cr-substituted BiFeO3. (C) 2015 Elsevier B.V. All rights reserved.
机译:采用共溅射技术制备了金属铁电(Cr-取代的BiFeO3)-绝缘体(HfO2)-半导体(MFIS)结构。通过XRD图案研究了在500℃,600℃和700℃后退火温度下BiFeO3(BFO)薄膜在Fe位置处Cr3 +取代的晶相。Cr取代的BiFeO3薄膜的微观结构和界面用TEM对HfO2和Si衬底之间的有机层进行了表征。研究了记忆窗与绝缘膜厚度和Cr直流功率的关系。当HfO2厚度增加到60 nm时,最大存储窗口为1.7V。由于电荷注入效应的降低,铁电极化随着取代量的增加而增加。结果与测得的泄漏电流一致。随着取代量的增加或退火后温度的降低,由于Cr取代的BiFeO 3的结晶少,表面粗糙度变得平滑。 (C)2015 Elsevier B.V.保留所有权利。

著录项

  • 来源
    《Microelectronic Engineering》 |2015年第4期|86-90|共5页
  • 作者单位

    Ming Chi Univ Technol, Dept Mat Engn, New Taipei City 243, Taiwan|Ming Chi Univ Technol, Ctr Thin Film Technol & Applicat, New Taipei City 243, Taiwan;

    Ming Chi Univ Technol, Ctr Thin Film Technol & Applicat, New Taipei City 243, Taiwan|Ming Chi Univ Technol, Dept Elect Engn, New Taipei City 243, Taiwan;

    Ming Chi Univ Technol, Dept Elect Engn, New Taipei City 243, Taiwan;

    Ming Chi Univ Technol, Ctr Thin Film Technol & Applicat, New Taipei City 243, Taiwan|Feng Chia Univ, Dept Elect Engn, Taichung 407, Taiwan;

    Ming Chi Univ Technol, Ctr Thin Film Technol & Applicat, New Taipei City 243, Taiwan|Chang Gung Univ, Dept Elect Engn, Taoyuan 333, Taiwan|Chang Gung Univ, Inst Electroopt Engn, Taoyuan 333, Taiwan;

    Ming Chi Univ Technol, Dept Elect Engn, New Taipei City 243, Taiwan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Mutiferroic BiFeO3; Metal-multiferroic-insulator-semiconductor (MFIS) structure; Memory window; Leakage current;

    机译:变质BiFeO3;金属-多铁-绝缘体-半导体(MFIS)结构;内存窗口;泄漏电流;

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