Photoresist coating methods for the integration of novel 3-D RF microstructures

Nga Phuong Pham; Boellaard E.; Burghartz J.N.; Sarro P.M.

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Photoresist coating methods for the integration of novel 3-D RF microstructures

机译：用于集成新型3-D RF微结构的光刻胶涂覆方法

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This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition (ED) are introduced and investigated for the fabrication of 3-D microstructures and RF-MEMS de

机译：本文介绍了在大型三维（3-D）形貌表面上涂覆光刻胶的三种方法。介绍并研究了两种特殊方法，即喷涂和电沉积（ED），以制造3-D微结构和RF-MEMS de

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来源
《Journal of Microelectromechanical Systems》 |2004年第3期|p.491-499|共9页
作者
Nga Phuong Pham; Boellaard E.; Burghartz J.N.; Sarro P.M.;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类自动化系统;微电子学、集成电路（IC）;
关键词
electrodeposition; micromechanical devices; photoresists; spray coating techniques; surface topography; 3D RF microstructures; RF-MEMS devices; electrodeposition; lithography; multilevel micromachined structures; photoresist coating methods; spray coating; topograph;

机译：电沉积;微机械设备;光刻胶;喷涂技术;表面形貌;3D RF显微结构;RF-MEMS器件;电沉积;光刻;多层微机械结构;光刻胶涂覆方法;喷涂;地形图;
入库时间 2022-08-18 01:27:19

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7. Photoresist coating methods for the integration of novel 3-D RF microstructures [O] . Boellaard, E. (author), Burghartz, J.N. (author), Sarro, P.M. (author) 2004

机译：用于集成新型3-D RF微结构的光刻胶涂覆方法

Photoresist coating methods for the integration of novel 3-D RF microstructures

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