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首页> 外文期刊>Journal of Microelectromechanical Systems >Fabrication and Characterization of Integrated Uncooled Infrared Sensor Arrays Using a-Si Thin-Film Transistors as Active Elements
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Fabrication and Characterization of Integrated Uncooled Infrared Sensor Arrays Using a-Si Thin-Film Transistors as Active Elements

机译:使用非晶硅薄膜晶体管作为有源元件的集成式非制冷红外传感器阵列的制作与表征

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摘要

In this paper, we report on the first realization and characterization of monolithic uncooled 8×8 infrared sensor ar rays, based on amorphous silicon thin-film transistors (a-Si TFT). The a-Si TFT is employed as the active element of the sensor, be cause it possesses a high temperature coefficient of its drain current of 1.5%-6.5% K{sup}(-1) at room temperature. The improved porous silicon micromachining techniques described here enable the inte gration of the a-Si TFT-based sensor array with the MOS readout circuitry. The sacrificial material of porous silicon is prepared in the first step. It is then well protected all the time during the fab rication of MOSFETs and sensors before being released. Optical tests are performed to characterize the sensor. The influences of the gate voltage of a-Si TFT (V{sub}g) and the voltage source of the cir cuitry (V{sub}(dd)) on the sensor performance are investigated. The mea surement indicates that the sensor has a maximum detectivity of 8.67 ×10{sup}8 cm Hz{sup}(1/2)W{sup}(-1) at V{sub}g = -15 V, V{sub}(dd) = -12 V and a chopping frequency of 30 Hz. The noise equivalent power (NEP) of the sensor is less than 10{sup}(-10) W Hz{sup}(-1/2), and the noise equiv alent temperature difference (NETD) is as low as 67 mK at room temperature, which compares well with the recent results of some uncooled IR sensors developed by other groups. Primary imaging tests indicate that the 8×8 sensor array has potential for high per formance imaging applications.
机译:在本文中,我们报告了基于非晶硅薄膜晶体管(a-Si TFT)的单片未冷却8×8红外传感器ar射线的首次实现和特性。 a-Si TFT被用作传感器的有源元件,因为它在室温下具有1.5%-6.5%K {sup}(-1)的漏极电流的高温系数。此处描述的改进的多孔硅微加工技术使基于a-Si TFT的传感器阵列与MOS读出电路集成在一起。在第一步中制备多孔硅的牺牲材料。然后,在制造MOSFET和传感器之前,一直将其保护好,然后再发布。进行光学测试以表征传感器。研究了a-Si TFT的栅极电压(V {sub} g)和电路的电压源(V {sub}(dd))对传感器性能的影响。测量表明,在V {sub} g = -15 V,V {下,传感器的最大探测灵敏度为8.67×10 {sup} 8 cm Hz {sup}(1/2)W {sup}(-1) sub}(dd)= -12 V,斩波频率为30 Hz。传感器的噪声等效功率(NEP)小于10 {sup}(-10)W Hz {sup}(-1/2),噪声等效温度差(NETD)在60℃时低至67 mK室温,可以与其他小组开发的一些未冷却的红外传感器的最新结果相比较。初步成像测试表明8×8传感器阵列具有用于高性能成像应用的潜力。

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