机译:55-
School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea;
Broadcom Ltd., Seoul, South Korea;
Samsung Electronics Company, Ltd., Hwaseong, South Korea;
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea;
School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea;
Mechatronics Research and Development Center, Samsung Electronics, Hwaseong, South Korea;
Mechatronics Research and Development Center, Samsung Electronics, Hwaseong, South Korea;
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea;
School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea;
Probes; Integrated circuits; Contacts; Micromechanical devices; Electrodes;
机译:制作15-
机译:制作15- <内联 - 公式>
机译:高灵敏度
机译:用于表征大阵列微间距微凸点探针卡的全自动测试系统
机译:混合