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Improving breakdown performance for SOI LDMOS with sidewall field plate

机译:用侧壁场板改善SOI LDMOS的细分性能

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In this work, a silicon-on-insulator (SOI) lateral diffused MOSFET (LDMOS) incorporated with sidewall field plate (SEP) is presented and investigated using three-dimensional numeric simulation. A new additional electric field peak is formed, due to the compound field plate established along the n-drift region. The lateral surface electric field can be modulated, which enhances the breakdown voltage. Meanwhile, the doping concentration of n-drift region is increased, which decreases the specific on-resistance. Compared with the superjunction LDMOS, a 23.7% increase in the breakdown voltage and a 21.7% decrease in the specific on-resistance are obtained in the SFP-LDMOS device.
机译:在这项工作中,使用三维数字模拟呈现并研究了包含与侧壁场板(SEP)的绝缘体上的绝缘体(SOI)横向扩散MOSFET(LDMOS)。由于沿N漂移区建立的复合场板,形成了一种新的额外电场峰。可以调制横向表面电场,从而增强击穿电压。同时,增加了N-漂移区的掺杂浓度,这降低了特定的导通电阻。与超结液LDMOS相比,在SFP-LDMOS器件中获得23.7%的击穿电压增加,具体的导通电阻下降21.7%。

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