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Improving breakdown performance for SOI LDMOS with sidewall field plate

机译:使用侧壁场板提高SOI LDMOS的击穿性能

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In this work, a silicon-on-insulator (SOI) lateral diffused MOSFET (LDMOS) incorporated with sidewall field plate (SEP) is presented and investigated using three-dimensional numeric simulation. A new additional electric field peak is formed, due to the compound field plate established along the n-drift region. The lateral surface electric field can be modulated, which enhances the breakdown voltage. Meanwhile, the doping concentration of n-drift region is increased, which decreases the specific on-resistance. Compared with the superjunction LDMOS, a 23.7% increase in the breakdown voltage and a 21.7% decrease in the specific on-resistance are obtained in the SFP-LDMOS device.
机译:在这项工作中,提出了并结合了侧壁场板(SEP)的绝缘体上硅(SOI)横向扩散MOSFET(LDMOS),并使用三维数值模拟对其进行了研究。由于沿着n漂移区建立了复合场板,因此形成了一个新的附加电场峰值。可以对侧面电场进行调制,从而提高击穿电压。同时,增加了n漂移区的掺杂浓度,这降低了比导通电阻。与超结LDMOS相比,SFP-LDMOS器件的击穿电压提高了23.7%,比导通电阻降低了21.7%。

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