Tin and tin-lead alloys solderable and, therefore, are used extensively in the electronics industry to bond electronic components. This precludes the need for strong fluxes to wet the deposit. Tin and lead can be codeposited easily because of the closeness of their standard electrode potentials. Tin and tin-lead deposits must possess all of the following characteristics; good solderability and reflowability; low porosity; good corrosion resistance; and uniformity of alloy composition, thickness, smoothness, and appearance, over a wide current density range.
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