HIGH-TEMPERATURE ACID COPPER PROCESS FOR PLATING THROUGH- HOLES

摘要

A new process has formulated for high-volume rigid PWB production, one thatrnis tolerant of temperatures up to 40℃. Excellent results were achieved at high temperatures, but this new process also runs very well at lower temperatures. Furthermore, the process can be used with either air or eductor nozzles, and the electrolyte is CVS analyzable or Hull cell controllable. Copper deposited using this system is bright, leveled, with enhanced microdistribution, and has excellent mechanical and physical properties that meet the IPC standards.