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Investigations on the frequency and temperature effects on mechanical properties of a shape memory polymer (Veriflex)

机译:频率和温度对形状记忆聚合物(Veriflex)力学性能的影响的研究

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This study proposes a comparison between three identification methods of the mechanical properties of a shape memory polymer (Veriflex (R)): quasi-static tensile tests, tensile dynamic mechanical analysis (DMA) and modal tests. The Young's modulus and the Poisson's ratio are determined at ambient temperature using the first technique. The DMA is used to determine the evolution of the viscoelastic properties versus the temperature and the frequency under harmonic loading. The modal analysis is used to identify the viscoelastic properties of the material at higher frequencies. The purpose of this study is to check the validity of the time-temperature equivalence for the Verifiex (R) obtained from the DMA measurements. It is shown that the viscoelastic properties predicted through the master curve are consistent with the measurements collected using quasi-static and modal test. The aging effect on SMP properties is also quantified. (C) 2015 Elsevier Ltd. All rights reserved.
机译:这项研究提出了形状记忆聚合物的三种机械性能鉴定方法(Veriflex(R))之间的比较:准静态拉伸试验,拉伸动态力学分析(DMA)和模态试验。使用第一技术在环境温度下确定杨氏模量和泊松比。 DMA用于确定在谐波载荷下粘弹性特性随温度和频率的变化。模态分析用于确定材料在较高频率下的粘弹性。这项研究的目的是检查从DMA测量获得的Verifiex(R)的时间-温度等效性的有效性。结果表明,通过主曲线预测的粘弹性与使用准静态和模态测试收集的测量结果一致。老化对SMP性能的影响也可以量化。 (C)2015 Elsevier Ltd.保留所有权利。

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