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Strain rate- and temperature-dependent tensile properties of an epoxy-based, thermosetting, shape memory polymer (Veriflex-E)

机译:环氧树脂基热固性形状记忆聚合物(Veriflex-E)的应变速率和温度相关的拉伸性能

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摘要

In this study, the inelastic deformation behavior of an epoxy-based, thermally triggered shape memory polymer resin, known as Veriflex-E, was investigated. The experimental program was designed to explore the influence of strain rate on monotonic loading at various temperatures which is needed to establish the design space of SMPs in load bearing applications. Thermally actuated shape memory polymers can be thought of as having two phases separated by the glass transition temperature (T_g). At temperatures below the T_g, Veriflex-E exhibits a high elastic modulus and positive, non-linear strain rate sensitivity in monotonic loading. The Poisson's ratio at room temperature is independent of the strain rate, but dependent upon the strain magnitude. As the temperature is increased, the strain rate sensitivity in monotonic loading decreases. Well above the T_g, the elastic modulus drops by several orders of magnitude. In this high temperature region, the material achieves strain levels well above 100% and Poisson's ratio is constant at 0.5 regardless of strain rate or strain magnitude.
机译:在这项研究中,研究了基于环氧树脂的热触发形状记忆聚合物树脂Veriflex-E的非弹性变形行为。设计该实验程序是为了探索在不同温度下应变率对单调加载的影响,这对于建立SMP在承载应用中的设计空间是必需的。可以将热致动的形状记忆聚合物视为具有被玻璃化转变温度(T_g)隔开的两个相。在低于T_g的温度下,Veriflex-E在单调加载中表现出高弹性模量和正非线性应变率敏感性。室温下的泊松比与应变率无关,但与应变大小有关。随着温度升高,单调加载中的应变率敏感性降低。远高于T_g,弹性模量下降几个数量级。在此高温区域,材料达到的应变水平远高于100%,而泊松比则恒定为0.5,与应变速率或应变幅度无关。

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