Electromechanical impedance-based damage localization with novel signatures extraction methodology and modified probability-weighted algorithm

摘要

Damage localization with electromechanical impedance is a significant technique in structural health monitoring and engineering community. In this paper, a newly-developed damage localization method is presented by integrating the novel signatures extraction methodology, direct-coupled mechanical impedance (DCMI), with a modified probability-weighted function. The DCMI methodology can be utilized to extract more damage-sensitive characteristic signatures from experimentally acquired raw signatures. Then a damage indicator, root mean square deviation (RMSD), is calculated in terms of real part and imaginary part of raw and DCMI signatures. The investigation on damage location imaging with a modified probability-weighted algorithm is subsequently performed and analyzed using the aforementioned indicators. To demonstrate the effectiveness of the proposed damage localization method, a series of verification experiments are conducted on a honeycomb sandwich composite structure with the surface-mounted piezoelectric sensor array. By comparing experimental results of damage localization, it is demonstrated that combining DCMI methodology with modified probability-weighted algorithm is capable of dramatically increasing the accuracy of damage location imaging.