ALIVH-B: ALIVH Substrate for Bare Chip Mounting

摘要

ALIVH (Any Layer Inner Via Hole) structure PWB for bare semiconductor chip mounting, such as MCM (Multi Chi Module) and CSP (Chip Size Package), has been developed. It is called "ALIVH-B". ALIVH structure has great potential for semiconductor packages. It is suitable for high density substrate, because there is no through-hole which disturbs components mounted on the surface area. Moreover, small thermal expansion difference between ALIVH and silicon ensures sufficient reliability of connection between the silicon chip and the substrate when a bare chip is mounted. In order to realize ALIVH-B substrate, ALIVH should have enough reliability for semiconductor package use and high wiring density. Therefore, low thermal expansion materials for organic substrate, reliable conductive paste, reliable copper foil and finer manufacturing processes have been developed. The resulting reliabilities are good enough for practical use.