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Impact of UV irradiation on thermally grown 4H-SiC MOS devices

机译:紫外线辐射对热生长4H-SiC MOS器件的影响

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摘要

The impact of ultraviolet (UV) light irradiation on thermally grown SiO_2/4H-SiC structures was investigated by characterizing the 4H-SiC metal-oxide-semiconductor (MOS) capacitors fabricated with and without UV irradiation onto the oxide layers. The UV irradiation was found to significantly increase a hysteresis in capacitance-voltage (C-V) characteristics and cause a positive flatband voltage (V_(FB)) shift, suggesting the generation of oxide charges and traps. Since the values of C-V hysteresis and V_(FB) shift depend on the UV irradiation time, the electrical defects were considered to be induced during UV irradiation. In contrast, UV irradiation caused no marked change for the reference Si-MOS capacitors, indicating that the generation of UV-induced electrical defects was an intrinsic property of thermally grown SiO_2/SiC structures. A detailed characterization of SiC-MOS capacitors with terraced SiO_2 layers revealed that the UV-induced defects were located near the SiO_2/SiC interface. The interfacial fixed charge density (Qox) was estimated to be 1.7×10~(12) cm~(-2) for the sample with UV irradiation, while that of the sample without UV irradiation was 1.0 × 10~(12) cm~(-2). Also, a slight increase was found in interface state density (D_(it)) due to UV irradiation. These results imply that the UV-induced defect generation correlates with residual carbon impurities at the SiO_2/SiC interface.
机译:通过表征在氧化层上有和没有紫外线照射下制造的4H-SiC金属氧化物半导体(MOS)电容器的特性,研究了紫外线(UV)照射对热生长的SiO_2 / 4H-SiC结构的影响。发现紫外线辐射会显着增加电容-电压(C-V)特性的磁滞现象,并引起正的平带电压(V_(FB))偏移,表明氧化物电荷和陷阱的产生。由于C-V磁滞和V_(FB)偏移的值取决于UV照射时间,因此认为在UV照射期间会引起电缺陷。相比之下,UV辐射对参考Si-MOS电容器没有明显变化,表明UV诱导的电缺陷的产生是热生长SiO_2 / SiC结构的固有特性。对具有阶梯形SiO_2层的SiC-MOS电容器进行了详细的表征,发现紫外线引起的缺陷位于SiO_2 / SiC界面附近。紫外线照射样品的界面固定电荷密度(Qox)估计为1.7×10〜(12)cm〜(-2),而紫外线照射样品的界面固定电荷密度(Qox)为1.0×10〜(12)cm〜。 (-2)。此外,由于紫外线照射,发现界面态密度(D_(it))略有增加。这些结果表明,紫外线引起的缺陷的产生与SiO_2 / SiC界面处的残留碳杂质有关。

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  • 来源
    《Materials science forum》 |2012年第2期|p.765-768|共4页
  • 作者单位

    Department of Material and Life Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Department of Material and Life Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    New Material Devices R&D Center, ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan;

    New Material Devices R&D Center, ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan;

    New Material Devices R&D Center, ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan;

    Department of Material and Life Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan,Research Center for Ultra-Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Department of Material and Life Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Department of Material and Life Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan,Research Center for Ultra-Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    4H-SiC; MOS device; ultraviolet (UV) irradiation; UV-induced defect; interface state density;

    机译:4H-SiC;MOS器件紫外线(UV)照射;紫外线引起的缺陷;界面状态密度;

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