Study on Electrical and Thermal Properties of Epoxy Resin/inorganicrnFiller Composites for the Fully Enclosed Casting Bus Bar and itsrnCalculation of the Temperature Field

摘要

This paper focused on the epoxy resin/inorganic filler composites. The electrical and thermal properties of the composites were tested and analyzed at room temperature. The influence of temperature on the thermal conductivity and thermal expansion coefficient was studied. Based on the electrical and thermal properties of the composites, the simulation model of the fully enclosed epoxy resin casting bus bar (FEERCB)was built, and the temperature field distribution of the FEERCB was calculated. T The study results showed that the volume resistivity, dielectric constant, dielectric loss factor and breakdown strength of the epoxy resin/inorganic filler composites were 1.74×10~(14)Ω·cm, 3.44, 3.75 and 22.31 kV/mm respectively at room temperature. The thermal conductivity and thermal expansion coefficient of the composites were 2.55 W/m·K and 21.73×10~(-6) /℃, achieved the insulation requirements for FEERCB. In the temperature range of the test, with increasing temperature, the thermal conductivity reduced gradually, while the thermal expansion coefficient increased gradually. The simulation results showed that the FEERCB has remarkable performance on the heat dissipation and current carrying capability.