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Challenges on Drive Circuit Design for Series-Connected SiC Power Transistors

机译:串联连接的SiC功率晶体管的驱动电路设计面临的挑战

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摘要

The breakdown voltages of the currently available 1.2 and 1.7-kV classes Silicon Carbide (SiC) transistors are not sufficient to operate under medium blocking voltages. On the other hand, the fabrication yields of the available high-voltage SiC transistors are still low, resulting in low current capabilities. Series-connection of several individual transistors is the solution to meet medium blocking voltages and high current ratings. This paper identifies the most crucial design challenges of gate and base drive circuits suitable for driving fast-switching series-connected SiC transistors. These challenges are presented and analyzed using Finite Element Method simulations and experimental investigations.
机译:当前可用的1.2和1.7 kV级碳化硅(SiC)晶体管的击穿电压不足以在中等阻断电压下工作。另一方面,可用的高压SiC晶体管的制造成品率仍然很低,导致低电流能力。几个单独的晶体管的串联连接是满足中等阻断电压和高额定电流的解决方案。本文确定了适用于驱动快速开关串联SiC晶体管的栅极和基极驱动电路的最关键设计挑战。使用有限元方法模拟和实验研究来提出和分析这些挑战。

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