Physical Modelling of Strain Induced Roughness of Copper Wire during Dieless Drawing Process

摘要

One of the possibilities of the dieless drawing is the production of ultrafine wire. In this case, it is possible for additionally stretch the wire, obtained in the conventional way. This may allow to obtain a wire of smaller diameter than the industry produces. However, the significant problem is the increase of the strain induced roughness of wire during dieless drawing. This problem has become important due to the fact that the resulting roughness can be comparable to the diameter of the wire and significantly reduce the workability. Thus, the solution of these problems requires plastometric studies of the material, physical and numerical modeling for prediction the roughness of the wire under conditions of dieless drawing. The experimental study shown, that the surface roughness of the copper wire after dieless drawing increases significantly at a deformation temperature above 300°C. The total roughness is associated both with the formation of oxides and the strain induced roughness.