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Photo-Assisted Corona-Charge Characterization of Wide Bandgap Interfaces with Deep Traps Invisible in Standard C-V

机译:具有深度陷阱的宽带隙接口的照片辅助电晕表征在标准C-V中不可见

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Wide bandgap semiconductor technology has been generating a great deal of attention due to its fundamental advantages in high power electronics. Understanding and effective control of interfacial properties belong to a group of critical issues requiring progress. In this work, we report progress in wide bandgap interface characterization, achieved using photo-ionization of deep traps under a non-equilibrium condition created by corona-charge bias in deep depletion. This characterization capability is demonstrated on oxidized n-type epitaxial 4H-SiC with deep interfacial traps invisible in standard C-V. These traps, initially present at high density, are shown to be reduced by half after a wet anneal. The photo-ionization technique is incorporated in commercially available non-contact C-V (CnCV) metrology [1,2] providing a non-invasive, cost and time saving metrology that benefits development research as well as device fabrication.
机译:由于其高功率电子产品的基本优势,宽带隙半导体技术一直在产生大量关注。理解和有效控制界面属性属于需要进展的一组关键问题。在这项工作中,我们报告了广泛的带隙界面表征的进展,在深耗尽中由电晕电荷偏压产生的非平衡条件下使用深陷阱的光电电离实现。该表征能力在氧化的n型外延4h-SiC上进行了对标准C-V中不可见的深界面陷阱。最初以高密度存在的这些陷阱被示出在湿退火后减少一半。光电电离技术掺入市售的非接触式C-V(CNCV)计量[1,2]中,提供了一种非侵入性,成本和时间节省的计量,这些计量受益于开发研究以及设备制造。

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