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Electro-work hardening of metals induced by the athermal electromigration effect

机译:非热电迁移效应引起的金属的电加工硬化

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Direct current stressing treatment has been proposed as an effective potential method to modify the micro-structures and optimize the mechanical properties of metals. Two contributions that could give rise to variations in the microstructure and mechanical properties of metals are involved in the direct current stressing treatment: thermal effects from Joule heat generation and athermal effects from electron-lattice interaction. The present study, for the first time, provides direct evidence of the work hardening behavior of pure Sn metals induced by the athermal electromigration effect, which is referred to the "electro-work hardening." The micro-hardness of the Sn strip increased for all of the current densities (4-7 × 10~3 A/cm~2) and current stressing times (1 h and 6 h) that were investigated. The maximum micro-hardness increment achieved could be as high as 27.3% at 5 × 10~3 A/cm~2 for 1 h as compared with the as-annealed Sn strip benchmark. The thermal benchmark experiment further evidences that the thermal Joule heating effect did not contribute to any variations in the micro-hardness, suggesting the predominant athermal effect of electromigration. The high-resolution transmission electron microscope lattice images further revealed a high volume of dislocations produced in the Sn matrix, which was responsible for the electro-work hardening behavior. The electro-work hardening mechanism incorporated in a direct current stressing treatment can be applied in metals without the need for macroscopic mechanical deformation pre-treatment, which is regarded as a non-deformation material treatment. This innovative method for inducing work hardening is considered to have great potential for applications in which products have already been shaped.
机译:直流应力处理已被提出作为一种有效的潜在方法,可以改变金属的微观结构并优化金属的机械性能。直流应力处理涉及两个可能导致金属的微观结构和机械性能变化的因素:焦耳热产生的热效应和电子-晶格相互作用的非热效应。本研究首次提供了由无热电迁移效应引起的纯锡金属的加工硬化行为的直接证据,这被称为“电加工硬化”。在所研究的所有电流密度(4-7×10〜3 A / cm〜2)和电流应力时间(1 h和6 h)下,锡带的显微硬度均增加。与退火后的锡带基准相比,在5×10〜3 A / cm〜2的条件下1 h达到的最大显微硬度增量可高达27.3%。热基准实验进一步证明了热焦耳加热效应不会导致显微硬度发生任何变化,这表明电迁移具有主要的无热效应。高分辨率透射电子显微镜的晶格图像进一步揭示了Sn基体中产生的大量位错,这是造成电加工硬化行为的原因。包含在直流应力处理中的电功硬化机制可以应用于金属,而无需进行宏观的机械变形预处理,这被认为是非变形材料处理。这种用于诱导加工硬化的创新方法被认为对于已经成型产品的应用具有巨大的潜力。

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