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Growth and characterization of (Pb, La)TiO_3 films with and without a special buffer layer prepared by RF magnetron sputtering

机译:(Pb,La)TiO_3薄膜的生长和表征及有无特殊缓冲层的射频磁控溅射制备

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摘要

The (Pb, La)TiO_3 (PLT) ferroelectric thin films with and without a special buffer layer of PbO_x have been deposited on Pt/Ti/SiO_2/Si(100) substrates by RF magnetron sputtering technique at room temperature. The microstructure and the surface morphology of the films annealed at 600℃ for 1 h have been investigated by X-ray diffraction (XRD) and atomic force microscope (AFM). The surface roughness of the PLT thin film with a special buffer layer was 4.45 nm (5 μm x 5 μm) in comparison to that of 31.6 nm (5 μm x 5 μm) of the PLT thin film without a special buffer layer. Ferroelectric properties such as polarization hysteresis loop (P-V loop) and capacitance-voltage curve (C-V curve) of the films were investigated. The remanent polarization (P_r) and the coercive field (E_c) are 21 μC/cm~2 and 130 kV/cm respectively, and the pyroelectric coefficient is 2.75 x 10~(-8) C/cm~2 K for the PLT film with a special buffer layer. The results indicate that the (Pb, La)TiO_3 ferroelectric thin films with excellent ferroelectric properties can be deposited by RF magnetron sputtering with a special buffer layer.
机译:通过室温下的射频磁控溅射技术,在Pt / Ti / SiO_2 / Si(100)衬底上沉积了具有和不具有特殊的PbO_x缓冲层的(Pb,La)TiO_3(PLT)铁电薄膜。通过X射线衍射(XRD)和原子力显微镜(AFM)研究了在600℃退火1 h后薄膜的微观结构和表面形貌。与没有特殊缓冲层的PLT薄膜的表面粗糙度为31.6 nm(5μmx 5μm)相比,具有特殊缓冲层的PLT薄膜的表面粗糙度为4.45 nm(5μmx 5μm)。研究了薄膜的极化滞后回线(P-V回路)和电容-电压曲线(C-V曲线)等铁电特性。 PLT膜的剩余极化(P_r)和矫顽场(E_c)分别为21μC/ cm〜2和130 kV / cm,热电系数为2.75 x 10〜(-8)C / cm〜2 K带有特殊的缓冲层。结果表明,具有特殊缓冲层的射频磁控溅射可以沉积具有良好铁电性能的(Pb,La)TiO_3铁电薄膜。

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