Fabrication and growth mechanism of metal (Zn, Sn) nanotube arrays and metal (Cu, Ag) nanotubeanowire junction arrays

Chung-Liang Cheng; Jia-Syu Lin; Yang-Fang Chen

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Fabrication and growth mechanism of metal (Zn, Sn) nanotube arrays and metal (Cu, Ag) nanotubeanowire junction arrays

机译：金属（Zn，Sn）纳米管阵列和金属（Cu，Ag）纳米管/纳米线结阵列的生长机理

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We report the successful synthesis of metal (Zn, Sn) nanotube arrays and metal (Cu, Ag) nanotubeanowire junction arrays electrochemically deposited through nanoporous anodic alumina membranes. The metal (Zn, Sn) nanotube arrays were achieved by preferen

机译：我们报告成功地合成了通过纳米多孔阳极氧化铝膜电化学沉积的金属（Zn，Sn）纳米管阵列和金属（Cu，Ag）纳米管/纳米线结阵列。金属（Zn，Sn）纳米管阵列是通过优选

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来源
《Materials Letters》 |2008年第11期|p.1666-1669|共4页
作者
Chung-Liang Cheng; Jia-Syu Lin; Yang-Fang Chen;
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作者单位

Department of Physics, National Taiwan University, Taipei 106, Taiwan;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
关键词
nanotubes; nanowires; anodic alumina membranes; electrodeposition;

机译：纳米管;纳米线;阳极氧化铝膜;电沉积;

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机译：时效对无铅球栅阵列（BGA）中界面（Cu，Ni）（6）（Sn，Zn）（5）和（Cu，Au，Ni）（6）Sn-5金属间化合物稳定化的影响焊点
2. Intermetallic Reactions in Reflowed and Aged Sn-9Zn Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads [J] . HSIU-JEN LIN, TUNG-HAN CHUANG Journal of Electronic Materials . 2006,第1期

机译：带有Au / Ni / Cu和Ag / Cu焊盘的回流和老化的Sn-9Zn焊球网格阵列封装中的金属间反应
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机译：带有Au / Ni / Cu和Ag / Cu焊盘的Sn-8Zn-20ln焊球网格阵列封装中的英特尔金属反应
4. Growth of Cu-Zn_5 and Cu_5Zn_8 Intermetallic Compounds in the Sn-9Zn/Cu Joint During Liquid State Aging [C] . RAMANI MAYAPPAN, ROSYAINI A. ZAMAN, ZALINA Z. ABIDIN, International Conference on X-ray and Related Techniques in Research and Industry . 2011

机译：在液态老化期间Sn-9Zn / Cu关节中Cu-Zn_5和Cu_5ZN_8金属间化合物的生长
5. High frequency electrical transport measurements of niobium SNS Josephson junction arrays and niobium thin films with nanoscale size magnetic dot array. [D] . Gomez, Luis B. 2003

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6. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1

机译：固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处（FeCrCoNiCu）Sn2金属间化合物的生长受到抑制
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机译：老化对PB免球栅极（BGA）焊点（BGA）焊点（BGA）焊点中的界面（Cu，Ni）6（Sn，Zn）6（Sn，Zn）5和（Cu，Au，Ni）6sn5金属间金属间金属间金属间金属间化合物的影响
8. Interface Microstructure and Composition of a YBa2CU3O(7-x) /N/ YBa2Cu3O(7-x) SNSEdge Junction with CaRuO3 as the Metallic Barrier [R] . Rozeveid, S., Merkle, K. L., Char, K. 1994

机译：以CaRuO3为金属阻挡层的YBa2CU3O（7-x）/ N / YBa2Cu3O（7-x）sNsEdge结的界面微结构和组成

Fabrication and growth mechanism of metal (Zn, Sn) nanotube arrays and metal (Cu, Ag) nanotubeanowire junction arrays

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