Effect of nano-silver particles in bonding material on field emission properties for carbon nanotube cathodes

摘要

Effects of bonding materials in a screen-printing paste on field emission properties were investigated for carbon nanotube (CNT) cathodes. The CNT cathodes were characterized for their dependence on current density in terms of the sintering behavior of the bonding material. As the diameter of the Ag particles in the bonding material decreased from 1000 nm to 10 nm, the current density of the CNT cathode increased. The sintering temperature of bonding materials was decreased for small silver (Ag) particles in bonding material. The higher current density for a CNT cathode fabricated with smaller Ag particles was primarily due to the lower sheet resistance of the bonding material after heat treatment.