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Electrical properties of p-type ZnTe thin films by immersion in Cu solution

机译:浸入铜溶液中的p型ZnTe薄膜的电性能

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摘要

ZnTe thin films were deposited on SiO_2 substrate by pulsed-laser deposition (PLD) at room temperature. The ZnTe films were immersed in different concentrations of Cu(NO_3)_2-3H_2O solutions for 1 min, then heated at 200 and 300 ℃, both temperatures for 10 min in a N_2 atmosphere. The X-ray diffraction (XRD) showed the hexagonal and orthorhombic ZnTe phases when the copper-doped films were heated at 200 and 300 ℃ for 10 min respectively. The films immersed in 15 and 60 mg of Cu(NO_3)_2-H_2O solutions had similar values of sheet resistance ~10~4Ω/□, resistivity ~ 10~(-1)Ω cm, specific contact resistance ~10~(-4)Ω cm~2, and hall mobility 5 cm~2/V s. Also, the copper-doped conditions were used to dope the source and drain bias to make a thin-film transistor of ZnTe (TFT) by photolithography.
机译:ZnTe薄膜在室温下通过脉冲激光沉积(PLD)沉积在SiO_2衬底上。将ZnTe薄膜浸入不同浓度的Cu(NO_3)_2-3H_2O溶液中1分钟,然后在N_2气氛中分别在200和300℃下加热10分钟。 X射线衍射(XRD)表明,分别将掺杂铜的薄膜分别在200和300℃下加热10分钟时,六方晶系和正交晶系ZnTe相。浸在15和60 mg Cu(NO_3)_2-H_2O溶液中的薄膜的薄层电阻值约为10〜4Ω/□,电阻率约为10〜(-1)Ωcm,比接触电阻约为10〜(-4 Ωcm〜2,霍尔迁移率5 cm〜2 / V s。而且,铜掺杂条件被用于掺杂源极和漏极偏压,以通过光刻法来制造ZnTe(TFT)的薄膜晶体管。

著录项

  • 来源
    《Materials Letters》 |2014年第1期|271-273|共3页
  • 作者单位

    PCeIM, Centro de Nanociencias y Nanotecnologia-UNAM, CP. 22860 Ensenada, Baja California, Mexico;

    PCeIM, Centro de Nanociencias y Nanotecnologia-UNAM, CP. 22860 Ensenada, Baja California, Mexico;

    Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, TX 75080, USA;

    Centro de Nanociencias y Nanotecnologia-UNAM, CP. 22860 Ensenada, Baja California, Mexico;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    ZnTe; Thin films; Cu doping; Thin-film transistor;

    机译:ZnTe;薄膜;铜掺杂;薄膜晶体管;

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