...
机译:超声辅助瞬态液相焊接过程中Cu / Sn / Cu接头中Cu3Sn的非界面生长
Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China|Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China|Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China|Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China|Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China;
Intermetallic alloys and compounds; Interfaces; TLP soldering; Ultrasonic waves; Grain morphology;
机译:在等温老化期间,低Ag Sn-0.3Ag-0.7Cu-XMN / Cu焊点界面Cu6Sn5和Cu3Sn5和Cu3Sn层的形态演化与生长动力学
机译:纳米TiO2颗粒对Sn-3.0Ag-0.5Cu-xTiO(2)焊点中界面Cu6Sn5和Cu3Sn层生长的影响
机译:用超声波焊接的TLP焊接形成Cu6Sn5和Cu3Sn关节微观结构和力学性能的比较研究
机译:超声波辅助瞬态液相焊接在Cu / Sn / Cu互连系统中Cu_6SN_5金属间化合物的生长行为研究
机译:液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
机译:纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMCs)的形成和生长的影响
机译:Cu-snO和Cu3sn金属间化合物初始形貌和厚度对sn-ag焊料/ Cu接头热老化过程中生长和演变的影响