首页> 外文期刊>IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging >Improved heat sinking for laser-diode arrays using microchannels inCVD diamond
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Improved heat sinking for laser-diode arrays using microchannels inCVD diamond

机译:使用CVD金刚石中的微通道改进了激光二极管阵列的散热

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This work proposes a novel cooling system for high-power laser-diode arrays, for which the maximum optical output power density per unit surface area is limited by the temperature rise due to self-heating. The proposed system uses a microchannel heat sink made of chemical-vapor-deposited (CVD) diamond, whose high thermal conductivity increases the efficiency of the channel-wall fins and reduces the array-to-coolant thermal resistance using a simple model for the combined conduction and convection problem. The resistance is calculated to be 75% less than that for a conventional configuration using a silicon microchannel heat sink. The present analysis strongly motivates a future experimental study
机译:这项工作提出了一种用于大功率激光二极管阵列的新型冷却系统,该系统的每单位表面积的最大光输出功率密度受自热引起的温度升高的限制。拟议的系统使用由化学气相沉积(CVD)金刚石制成的微通道散热器,该散热器的高导热率可通过使用简单的组合模型来提高通道壁散热片的效率并降低阵列至冷却剂的热阻。传导和对流问题。计算得出的电阻比使用硅微通道散热器的常规配置小75%。本分析强烈地推动了未来的实验研究

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